Excimer laser ablation device LD12
A room temperature, laser-based wafer detachment device compatible with wafer sizes up to 300mm.
■ This is a wafer detachment device necessary for the transport/process of thin wafers. ■ It supports various wafer sizes up to 300mm, using room temperature and laser-based wafer detachment.
- Company：ズース・マイクロテック
- Price：Other
